Industrial domain

Cutting & Grinding

Dies & Jigs

Materials

Baikowski Japan Co., Ltd.

Baikowski supports cutting-edge technologies with its ultrafine particle technology.

We provide high-purity alumina and other ultrafine particles as raw material or abrasive to the electronic, lighting and advanced ceramics industries to support cutting-edge technologies. We develop specialty products, such as simple materials, composite materials and slurry, and constantly improve the quality of our products to match the applications and technologies of our customers.
Postal code

275-0001
Address 6-17-13 Higashi-Narashino, Narashino-shi
Phone number +81-47-473-8150
Fax +81-47-473-8153
Contact
Website http://www.baikowski.co.jp/
Representative director

Takeshi Shigeta

Established

 1988.11
Capital 70million yen
Number of employees 24

Business activities

- Manufacturing, import and sale of high-purity oxide fine powder, abrasives, secondary materials for polishing, etc.

Main products and processes

- High-purity oxide fine powder (alumina, spinel, ceria)
- Alumina, ceria CMP slurry
- Ceramic YAG products
- Secondary materials for polishing

Facilities and equipment

  • - One set of TOPCON scanning electron microscope LS750
  • - One set of ZYGO scanning probe microscope NV5022
  • - One set of ZYGO laser interferometer GPI-XP
  • - Two units of Horiba particle size distribution analyzers (LA920 and LA950)
  • - One unit of KLA-Tencor surface profiler P-22H
  • - One unit of Nanometrics film thickness measurement system NanoSpec 6100

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